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Reference: BRD-170TDMINIBRD
Mini Solderless Prototype Experiment Test Breadboard 170 Tie-points 35*47*8.5mm.
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Design and change circuits quickly and cleanly. Breadboards accommodate all sizes of dips and discrete components with lead diameters up to 0.032". Interconnect with solid hook-up wire (#22 AWG recommended). Wires and components can be used and re-used many times without damage to board or components..
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Mini Solderless Prototype Experiment Test Breadboard 170 Tie-points 35*47*8.5mm.
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